Apparatus for mounting components on a substrate
CA 1136834 A · Owner: Matsushita Electric Industrial Co. Ltd. · Inventors: Araki, Shigeru; Mori, Kazuhiro; Taki, Yasuo
Overview
Its claims, description and drawings are in the Canadian Patents Database.
Open the CIPO recordAbstract From the Canadian patent
An improved component engaging apparatus mounts electrical and electronic chip components or the like on a circuit board or substrate. A unit applies a bonding agent to the substrate and a chip component mounting section mounts the components on the bonding agent on the substrate. A component feeding section sequentially feeds the components. A driving section operates the component feeding section and a substrate, support section is arranged to alter its position with respect to the component mounting section and the bonding agent applying section.
Read the whole patent
Listed from its CIPO record in Patent Yard's archive of Canadian patents past their term. Its claims, description and drawings are in the CIPO record and on Google Patents, and the Claude kit works from them.
Why it's free to use
- Granted December 7, 1982. A Canadian patent filed before October 1, 1989 lasted 17 years from grant, so its term ended December 7, 1999.
- We check Canadian rights only. A patent in its family in another country could still be in force: check its family on Google Patents.
Sources & verification
Official CIPO records
Everything on this page comes from the CIPO record linked above. Contains information licensed under the Open Government Licence – Canada.