Modular housing for electronic apparatus

Abstract From the Canadian patent

Abstract of the Disclosure, A modular housing molded of a thermoplastic material and arranged for containing electronic circuitry is disclosed. The modular housing includes a box-like base unit, two removable modules, and a rear cover unit. The base unit forms a first housing for containing electrical apparatus. The upper surface of the base unit includes two traylike recesses for receiving and containing the two modules which are configured for containing additional electronic apparatus. The base unit recesses and the modules are configured and arranged such that each module is securely retained within the base unit recesses without the use of conventional tray-like recess in which the …