Plastic encapsulated semiconductor devices and method of making same
CA 1079868 A · Owner: Mitsubishi Denki Kabushiki Kaisha · Inventors: Morita, Yutaka; Ishibashi, Kiyoshi; Yamane, Masahiro
Overview
Its claims, description and drawings are in the Canadian Patents Database.
Open the CIPO recordAbstract From the Canadian patent
The present invention provides a method of preparing plastic encapsulated semiconductor devices which comprise the steps of: preparing a connected metal plate in which a plurality of semiconductor element holding parts are connected in series in one direction with at least two connecting arms disposed between each pair of semiconductor holding parts said connecting arms each having an area smaller than that of said semiconductor element holding parts; forming said connecting arms inside the side surfaces of said semiconductor element holding parts in the connecting direction; providing semiconductor elements having a pair of main surfaces in parallel with each other; bonding the …
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Listed from its CIPO record in Patent Yard's archive of Canadian patents past their term. Its claims, description and drawings are in the CIPO record and on Google Patents, and the Claude kit works from them.
Why it's free to use
- Granted June 17, 1980. A Canadian patent filed before October 1, 1989 lasted 17 years from grant, so its term ended June 17, 1997.
- We check Canadian rights only. A patent in its family in another country could still be in force: check its family on Google Patents.
Timeline
Timeline From CIPO dates
Sources & verification
Official CIPO records
Everything on this page comes from the CIPO record linked above. Contains information licensed under the Open Government Licence – Canada.