Process for cementing semiconductor discs to carrier plates and product so obtained

Abstract From the Canadian patent

Process for cementing semiconductor discs to a carrier plate for subsequent polishing which comprises, applying to the discs a cementing solution being composed of a) a resin of a melting range between 50 and 100°C and a melt viscosity between 1000 and 6000 P; b) a substance acting as plasticizer for the resin at cementing temperatures and, c) a solvent for the resin and the plasticizer which evap-, orises at cementing temperatures while avoiding during the application the occlusion of air bubbles between discs and cementing layer and exerting, pressure onto the plates at a temperature between cementing temperature and 30°C below the same. The invention also comprises the carrier plate …