Multilayer interconnect system, and method of making
CA 1073557 A · Owner: International Business Machines Corporation · Inventors: Fang, Frank F.; Doo, Ven Y.
Overview
Its claims, description and drawings are in the Canadian Patents Database.
Open the CIPO recordAbstract From the Canadian patent
A large scale integrated circuit multilayer interconnect system in which signal propagation delay is substantially reduced by using air as the dielectric between layers rather than an in-, sulating material. The system is comprised of a plurality of two basic layers, namely a signal plane layer and a reference plane layer. The basic layers are spaced from and alternated with one another by insulated spacers to maintain a desired air gap.
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Listed from its CIPO record in Patent Yard's archive of Canadian patents past their term. Its claims, description and drawings are in the CIPO record and on Google Patents, and the Claude kit works from them.
Why it's free to use
- Granted March 11, 1980. A Canadian patent filed before October 1, 1989 lasted 17 years from grant, so its term ended March 11, 1997.
- We check Canadian rights only. A patent in its family in another country could still be in force: check its family on Google Patents.
Timeline
Timeline From CIPO dates
Sources & verification
Official CIPO records
Everything on this page comes from the CIPO record linked above. Contains information licensed under the Open Government Licence – Canada.