Integrated circuit package
CA 1069220 A · Owner: Amp Incorporated · Inventors: Grabbe, Dimitry G.
Overview
Its claims, description and drawings are in the Canadian Patents Database.
Open the CIPO recordAbstract From the Canadian patent
An integrated circuit package comprises an electrically insulating material frame defining a cavity; an integrated circuit chip received in the cavity; conductive leads extending from the chip through the frame for connection to external circuitry; a sealing material gel surrounding the chip in the cavity; and a closure member sealing the cavity the closure, member being fractionally engaged with the frame.
Read the whole patent
Listed from its CIPO record in Patent Yard's archive of Canadian patents past their term. Its claims, description and drawings are in the CIPO record and on Google Patents, and the Claude kit works from them.
Why it's free to use
- Granted January 1, 1980. A Canadian patent filed before October 1, 1989 lasted 17 years from grant, so its term ended January 1, 1997.
- We check Canadian rights only. A patent in its family in another country could still be in force: check its family on Google Patents.
Timeline
Timeline From CIPO dates
Sources & verification
Official CIPO records
Everything on this page comes from the CIPO record linked above. Contains information licensed under the Open Government Licence – Canada.