Process for fabricating a heat exchanger
CA 1063442 A · Owner: Carrier Corporation · Inventors: Watson, James J. (Jr.)
Overview
Its claims, description and drawings are in the Canadian Patents Database.
Open the CIPO recordAbstract From the Canadian patent
An ultrasonic dip soldering process for bonding the tubular joints of a heat exchanger made up of tubular components joined together to form flow circuits within a fan coil. The joints are positioned adjacent to one of the tube sheets of the fan co 1 structure and the joints preheated by means of a remote heating process. The joints are then immersed in a molten bath of solder and treated to ultrasonic energy while in the bath.
Read the whole patent
Listed from its CIPO record in Patent Yard's archive of Canadian patents past their term. Its claims, description and drawings are in the CIPO record and on Google Patents, and the Claude kit works from them.
Why it's free to use
- Granted October 2, 1979. A Canadian patent filed before October 1, 1989 lasted 17 years from grant, so its term ended October 2, 1996.
- We check Canadian rights only. A patent in its family in another country could still be in force: check its family on Google Patents.
Timeline
Timeline From CIPO dates
Sources & verification
Official CIPO records
Everything on this page comes from the CIPO record linked above. Contains information licensed under the Open Government Licence – Canada.