Lead bond structure
CA 1056514 A · Owner: General Electric Company · Inventors: Webster, Harold F.; Cusano, Dominic A.
Overview
Its claims, description and drawings are in the Canadian Patents Database.
Open the CIPO recordAbstract From the Canadian patent
A bond between a refractory metal or semiconductor and a ductile metal and a method for making the same includes forming a layer of a refractory metal wetting agent such as titanium on the refractory metal before bonding to allow wetting of the refractory metal by the ductile metal.
Read the whole patent
Listed from its CIPO record in Patent Yard's archive of Canadian patents past their term. Its claims, description and drawings are in the CIPO record and on Google Patents, and the Claude kit works from them.
Why it's free to use
- Granted June 12, 1979. A Canadian patent filed before October 1, 1989 lasted 17 years from grant, so its term ended June 12, 1996.
- We check Canadian rights only. A patent in its family in another country could still be in force: check its family on Google Patents.
Timeline
Timeline From CIPO dates
Sources & verification
Official CIPO records
Everything on this page comes from the CIPO record linked above. Contains information licensed under the Open Government Licence – Canada.